Real time solidification
observation experiments of the soldering process were successfully performed using
a synchrotron X-ray imaging technique. The technique development which includes experimental setup with
calculated optimum beam energy in the range of 20 – 30 keV allows in a clear
observation of real-time X-ray imaging of the soldering process. Post synchrotron imaging experiment samples
were further analysed using scanning electron microscope (SEM) imaging,
electron-dispersive X-ray spectroscopy (EDX) and electron backscattered
diffraction (EBSD) to complement the synchrotron imaging findings. The synchrotron
imaging experiment findings together with post experimental analysis results
provide an in-depth understanding of the reactions during soldering. This technique provides a key method
to understand the mechanism of formation of micro-electronic inter-connects for
future electronic packaging applications which enabled a detailed
insight of the soldering reaction using different solder alloys on different
substrates.