We demonstrate the strain analysis of a typical electric device using CBED combined with numerical optimization and finite element method (FEM). The suggested approach is consisted from three parts. First part is image matching process between experimental and simulated CBED patterns. It is possible to estimate a sample thickness and crystal bend by searching an optimized calculation image, which most coincident with the experiment image, from images calculated in advance for varieties of sample thicknesses and crystal bend [1]. The technique of direct comparison between experimental and simulated images is, however, associated with some difficulties. For example, we need huge data store region to store the CBED pattern as a two-dimensional intensity map. The present method proposes the method to express CBED pattern via Zernike moments. From this approach, dimension of stored image is drastically decreased. The second step is the numerical optimization to obtain one-dimensional or two-dimensional bend distributions. In this step, as the optimization algorithm, we use SIMPLEX method. By using some scattered disks together with transmitted disc and utilizing the characteristics of crystal bend gently, we estimate the initial design to avoid the multimodal problem. Finally, third step is estimation process of induced stress. The physical quantity which we want to know is not a distribution of crystal bend, but stresses that cause the crystal bend distribution. Since complex structure of modern electric device, however, provides some stressors, it is difficult to estimate the quantitative stresses at each stressor. Therefore, by using again an optimization technique and a structure calculation by FEM that is set to be stresses as the variables, we propose a method of obtaining a stress which reproduces the crystal bend is determined by experiment. From these steps, we found the stress distribution induced in the actual device with high accuracy.